Plasma Cleaner/Asher Reaction Chamber

Plasma Cleaner/Asher

Our range of Plasma Cleaner/Asher (desktop reaction chamber) unit can facilitate the removal of atomic contamination, removal of Oxides, and  Hydrophilic/Hydrophobic plasma treatment.

There are many differences between the nature of plasma, at 40 kHz, 400 KHz  Microwave and 13.56 MHz RF.

However, it may be possible to use all of these frequencies in some applications.

In general, at low frequencies, both electrons and ions are displaced in the plasma medium. Ions have a negative or positive electric charge, and the mass of ions is much higher than that of an electron.

  • At the low frequencies, there is ample opportunity to move both ions and electrons.
  • At the higher  frequency, the less opportunity the ions have to move.
  • Allowing the plasma density to increase at high frequencies.
  • Plasma densities are generally higher at RF frequencies than at Low Frequency (LF).
  • In addition, due to the acceleration of ions, which have a high mass, the phenomenon of sputtering of the sample and the surface of the product or the contamination caused by the chamber walls are higher in the LF frequency. resulting in the transfer of more heat load to the sample, due to  then LF the accelerated particles collide at a hight rate.

*In general, low frequency plasma can be used for physical operations, microwave frequencies for chemical operations, and rf frequencies for both.*

For example, high frequency is the best option for performing chemical interactions at the surface of a product or sample. Due to the electrons that produce ions and radicals, producing plasma.

In this case the Ions motility is small, they do not have a destructive effect and under these conditions, there are large numbers of ions and radicals on the surface of the product or sample that are ready to undergo chemical reactions.

In addition, with increasing frequency, other parameters such as internal bias also decrease.
As the frequency increases (towards the microwave), the plasma changes from a volumetric uniform plasma to a surface plasma (due to the penetration depth limitations).
And other differences…

Key areas:

  • One or two gas input options Argon, Oxygen, Nitrogen, forming gas for Hydrogen gas cracking.
  • Flow meter or Mass flow controller
  • Three Frequencies to select from. ( RF could be upgradable if planned at the build stage)
  • Heated sample upto 350 centigrade